Silicon wafer
2-12 inch silicon wafer

Silicon wafer is currently the main material for making integrated circuits in the semiconductor industry. Generally, most of the produced wafers are single-crystal silicon wafers. Columnar silicon ingots are first refined. After slicing and grinding, they become mirror-like silicon wafers with uniform thickness. Silicon wafer itself does not conduct electricity. However, once some ions are properly doped, positive and negative electrodes can be formed to control the flow of electrons. There are two types of semiconductors, N-type semiconductors and P-type semiconductors. In N-type semiconductors, there are excessive electrons. These excessive electrons (called free electrons) allow electrons in the semiconductor to move freely. In contrary, P-type semiconductors are in a state of insufficient electrons to form holes. In order to fill up the holes, electrons will be forced to move, which generates current.

Applicable industries

Raw materials for making integrated circuit, DRAM, photodiodes, discrete components, solar cell substrates, electronic components, semiconductor components, chip power semiconductors, power management, MEMS, LCD driver ICs, fingerprint recognition, embedded memory, CMOS, mobile communications, automotive electronics, Internet of Things (IoT), industrial electronics, etc.

Silicon wafers can be customized according to the requirements
Size (Inch) Polishing Model Crystal orientation Resistivity Ω•cm Thickness (micrometer)
2 Single polish P/N 100/111 Low resistance 0-20/High resistance 5000-20000 400±25
4 Single polish P/N 100/111 Low resistance 0-20/High resistance 5000-20000 525±25
6 Single polish P/N 100/111 Low resistance 0-20/High resistance 5000-20000 675±25
8 Single polish P/N 100/111 Low resistance 0-20/High resistance 5000-20000 725±25
12 Single polish/Double polish P/N 100/111 Low resistance 0-20/High resistance 5000-20000 725±25
Customized wafer coating

Bare wafer/ dummy wafer/ coin-roll / test wafer, 2-12 inch wafer coating, wafer chromium (Cr) coating/wafer aluminum (Al) coating/wafer molybdenum (Mo) coating/wafer silicon (Si) coating/wafer copper (Cu) coating, wafer titanium (Ti) coating, and other wafer glass coating services, test wafer, dummy wafer, prime wafer, epi wafer, silicon wafer processing (coating Si + oxide wafer), Al wafer, Au wafer, SOI wafer, SOC wafer.

Applicable industries

Raw materials for making integrated circuit, DRAM, photodiodes, discrete components, solar cell substrates, electronic components, semiconductor components, chip power semiconductors, power management, MEMS, LCD driver ICs, fingerprint recognition, embedded memory, CMOS, etc.

Wafer coating can be customized according to the requirements(Cr/Mo/Cu/Sn/Ti/Sio2/Si3N4)
2-12 inch wafer packaging box

Wafer cassette/wafer box/wafer transfer box/wafer tray is a sealed and isolated clean container, mainly used for carrying wafers. It is used to store and protect wafers, preventing wafer collision, scratching, and reducing the risk of wafer contamination. It is efficient and safe to use, and meets the requirements for wafer storage, transportation or shipment. Each wafer cassette of different sizes can be used to store silicon wafer/quartz/glass/sapphire.

Applicable industries

Wafer storage, industrial laboratories, academic laboratories, national laboratories, clean rooms, semiconductors, optoelectronics, solar cells, electronics, panels, solar energy, light-emitting diodes, etc.

Type 2 inch 4 inch 5 inch 6 inch 8 inch 12 inch
Single-wafer cassette
 
   
25-piece wafer cassette
 
25-piece wafer package  
50-piece wafer package  
8-inch hexagonal single-wafer sample box        
 
8-inch square single-wafer sample box        
 
12-inch square single-wafer box          
Glass wafer

2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafer glass. Wafer glass is made of customer-specified glass material. The ultra-thin glass wafers are suitable for MEMS and optoelectronic application. The diameter ranges from 50mm to 300mm, while the thickness ranges from 0.2mm to 1.8mm. It is produced by high-precision CNC and advanced laser equipment, resulting in extremely accurate dimensional tolerances and TTV values.

In addition, customized processing can be carried out according to customer needs. Customers can select glass type/thickness/size for processing.

Glass types: conductive glass, optical glass, alkali-free glass, quartz glass, BK7 glass, BK9 glass, B270 glass, Engle2000 glass, EXG glass, and D263 glass.

Applicable industries

It can be applied to the semiconductor industry, wafer foundry, wafer packaging and testing, semiconductor equipment, and semiconductor related industries.

Based on the needs of customers, select glass type/thickness/size to make glass wafers
  2 inch 4 inch 6 inch 8 inch 12 inch
Conductive glass
Optical glass
Alkali-free glass
Quartz glass
Material specified by the customer